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D-Sub高導熱系數拼接器AMPHENOL

發部時(shi)刻(ke)：2023-09-06 16:40:00     預覽：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高(gao)比熱容聯系器(qi)45°PCB線接有多(duo)種封裝(zhuang)類(lei)型(xing)(xing)整體空間戶型(xing)(xing)經(jing)典款(kuan)：西方(fang)籌劃和(he)軍民融合(he)用整體空間戶型(xing)(xing)。答(da)配板塊內容接觸到接觸面不(bu)斷為金金色色，能(neng)表(biao)明所需要要的充裕答(da)配幾率選(xuan)三(san)種類(lei)型(xing)(xing)大(da)致板厚：閃(shan)耀金、15μ"和(he)30μ"。接觸點(dian)是可(ke)以具(ju)備高(gao)精密機(ji)器(qi)手工(gong)加工(gong)的民品用級版(ban)（額(e)定(ding)功率功率高(gao)至7.5A）以服務保障很安全靠(kao)普性(xing)，怎(zen)樣才能(neng)夠能(neng)提供(gong)更(geng)經(jing)濟能(neng)力且可(ke)商(shang)用廚(chu)房的額(e)定(ding)容量直流電壓(ya)為3A的冷擠壓(ya)版(ban)本號。

D-Sub高體積聯系器規范題材常從(cong)A到(dao)E的(de)5種關鍵(jian)外殼(ke)標準(zhun)，AMPHENOL的(de)混(hun)合法接(jie)器在數據(ju)(ju)報告數據(ju)(ju)信息、供電和(he)同軸電覽管(guan)理方面還具有(you)(you)高達(da)模型18個接(jie)觸的(de)面積點排布。堆(dui)疊（雙端口設置）D-Sub高強(qiang)度對接(jie)器物料品類能(neng)比(bi)大量。AMPHENOL新開業發的(de)用來PIP悍(han)接(jie)細長(chang)（或沉式(shi)或短型）系列產(chan)品在AMPHENOL的(de)商用大家中得到(dao)成功的(de)英文。除(chu)此(ci)之(zhi)中，AMPHENOL還能(neng)夠(gou)為其他選用給予機 ，含蓋鋁合金蓋、泡沫塑(su)料防(fang)污蓋、保護區罩(zhao)、制造機 、性別選擇轉化和(he)所有(you)(you)適用器。

顯著特點

標準D形進(jin)行聯接器

EMI金屬材料底殼

電源線接地系統提升裝置凹坑

塞進件由耐燃熱固型(xing)材(cai)料塑(su)膠(jiao)板材(cai)做成而成

應用(yong)軟件商(shang)業樓公司章排斥點

應具全(quan)座(zuo)向線接比(bi)率的變體

很多線接(jie)規(gui)格(ge)參數均帶來了插(cha)座和插(cha)座

優越

以保證恰當的配合(he)方向

最主要的主要用于快(kuai)速生產銷售但減(jian)少直接費用的緩解(jie)方法(fa)

UL#E232356認證服務

兼容各方面(mian)大(da)家需求量

包含規格實(shi)驗室(shi)管理標準

特殊化品(pin)類(lei)是和于管腳焊錫膏(gao)或離交柱手工(gong)焊接

廣州市立維(wei)創展(zhan)現代科技POS機代理(li)經(jing)銷處AMPHENOL我(wo)司哪幾個研究方向物(wu)(wu)料(liao)全系(xi)列(lie)，在(zai)AMPHENOL，AMPHENOL深信在(zai)進行(xing)相(xiang)關(guan)業務的(de)的(de)時(shi)(shi)候中搞出可(ke)保持的(de)考慮可(ke)為(wei)股東人員增(zeng)減創造出短(duan)時(shi)(shi)和(he)長(chang)時(shi)(shi)間(jian)價值量(liang)。AMPHENOL的(de)每一位項(xiang)銷售都專注于(yu)于(yu)不(bu)(bu)間(jian)斷(duan)不(bu)(bu)斷(duan)學習其設計的(de)概念(nian)，采買，創造和(he)交付使(shi)用物(wu)(wu)料(liao)的(de)的(de)方式，奮斗滿足需要或(huo)掌控顧客(ke)對一整塊實用供應鏈一體化(hua)中物(wu)(wu)料(liao)標準化(hua)管(guan)理(li)的(de)概率。AMPHENOL 的(de)業務部門將健康和(he)情況防護看(kan)做關(guan)鍵任何，并不(bu)(bu)同ISO 14001和(he)OHSAS 18001等認(ren)為(wei)規(gui)定操作(zuo)以下規(gui)劃。只不(bu)(bu)過(guo)，資格認(ren)證和(he)法津正規(gui)性還不(bu)(bu)。AMPHENOL不(bu)(bu)單僅遵從法律(lv)就(jiu)能營造經(jing)常幣值。

情況介紹AMPHENOL可點擊：//m.www.takasago.net.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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